Benelux RF Conference 2024 - Bits&Chips Events

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Registration

09:00-09:30

During the conference, visitors can roam the exhibition floor to meet our sponsors, network with other attendees and check out the poster presentations by our regional PhD talent.

Keynote

09:30-10:15

SiGe technologies for high-resolution radar: circuits, functionality and system-level results

Nils Pohl (Fraunhofer/Ruhr University)

SiGe technologies for high-resolution radar: circuits, functionality and system-level results

Nils Pohl (Fraunhofer/Ruhr University)

Nils Pohl will address the potential of modern SiGe technologies to enable high-resolution radar by achieving extreme wide-bandwidth and terahertz operation frequency. On the other hand, advanced functionality is enabled by integrating multiple channels and additional features like clutter-free harmonic radar localization. Therefore, the potentials on circuit level will be motivated and highlighted circuits will be discussed. Additionally, system design aspects are considered and finally, system-level results will be shown to use radar with the highest resolution and highest range measurement precision.

Nils Pohl received the Dipl.-Ing. and Dr.Ing. degrees in electrical engineering from Ruhr University Bochum, Germany, in 2005 and 2010, respectively. From 2006-2011, he was a research assistant with Ruhr University Bochum, where he was involved in integrated circuits for millimeter-wave radar applications. In 2011, he became an assistant professor there. In 2013, he became the head of the department of mm-wave radar and high-frequency sensors with the Fraunhofer FHR, Wachtberg, Germany. In 2016, he became a full professor for integrated systems with Ruhr University Bochum. In parallel, he’s head of the research group for integrated radar sensors at Fraunhofer FHR. He has authored or coauthored more than 200 scientific papers and has issued several patents. His current research interests include ultra-wideband mm-wave radar, design and optimization of mm-wave integrated SiGe circuits and system concepts with frequencies up to 500 GHz and above, as well as frequency synthesis and antennas.

EuMA PhD pitches

10:15-11:00

In a series of pitches, selected PhD students have the opportunity to present their work on RF circuits and electromagnetics to our expert industry audience. The best pitch will be awarded a prize, sponsored by EuMA.

Jelle Bakker (UT)

Characterization of photodiodes in 22 nm FDSOI at 850 nm

Senne Gielen (KU Leuven)

A D-band 20.4 dBm OP1dB transformer-based power amplifier with 23.6% PAE in a 250 nm InP HBT technology

Marios Neofytou (NXP/TUE)

A 76-to-81 GHz direct-digital 7b 14 GS/s double-balanced I/Q mixing-DAC radar-waveform synthesizer

Deovrat Phal (TUE)

Measurement accuracy and uncertainty of QA methods for deep-regional RF hyperthermia

Bagas Prabowo (TU Delft)

A cryo-CMOS receiver with 15 K noise temperature achieving 9.8 dB SNR in 10 µs integration time for spin qubit readout

Break

11:00-11:30

Front-end design

11:30-12:00

Re-thinking the mm-wave MIMO radar architecture for future automotive radars

Kostas Doris (NXP)

Re-thinking the mm-wave MIMO radar architecture for future automotive radars

Kostas Doris (NXP)

The evolution of high-performance mm-wave CMOS MIMO radar transceivers in the 76-81 GHz band is enabling nowadays Level 2 and 3 autonomous driving vehicles. For higher levels of autonomy, future radars must be able to perform precise mapping of the environment, localization and enhanced object classification. This requires sub-degree angular resolution for azimuth and elevation with wide fields of view, longer ranges and higher range resolution, smaller velocity ambiguities and robustness to radar-to-radar interference. Radar housing and power dissipation limitations and need for cost effectiveness make achieving such performance levels very challenging.

In this talk, Kostas Doris will initially cover waveform, antenna and circuit architectural innovations that will allow for the ultimate large-scale MIMO radar architecture to reach the performance limits imposed by the 76-81 GHz band. Further, he’ll go into the opportunities and challenges of breaking such limits with a revolutionary step to a new band beyond 100 GHz that offers more spectral resources. He’ll describe why re-thinking of the radar architecture, adoption of new technologies and emphasis on the importance of in-package integration of antennas and circuits is required to unlock the potential of such a band.

Kostas Doris is a fellow at NXP Semiconductors and a professor at Eindhoven University of Technology, where he also received the PhD degree in 2004. He worked at Philips Research Laboratories and NXP Research developing high-performance data converters for wireless infrastructure and cable modem applications. Since 2012, he’s focusing on automotive mm-wave radar, leading R&D activities across mm-wave CMOS transceivers, process technology and advanced packaging for NXP’s next-generation mm-wave radar products.

Front-end design

12:00-12:30

Design challenges for next-generation agile antenna front-ends

Rens Baggen (IMST)

Design challenges for next-generation agile antenna front-ends

Rens Baggen (IMST)

6G, automotive radar and SAR are only a few of many applications where reconfigurable antenna front-ends are key components. The continuous demand for more bandwidth and throughput pushes antenna designs to higher and higher frequency bands and higher output power. The physical size/form factor of the antenna aperture becomes therefore smaller and smaller, having a significant impact on the available real estate for the layout of the RF components and the complexity of thermal management. This is especially true for antenna designs beyond Ka-band, ie at Q/V/W-band. Latter aspects will be discussed and examples will be shown of current and future technologies to address these challenges.

Rens Baggen was born in the Netherlands and graduated from Eindhoven University of Technology in 1992 in the field of antennas and propagation. He started working at the Netherlands Aerospace Centre (NLR) in Amsterdam in 1993 where he worked in the fields of avionics and quality management. In 1995, he joined the department of Antennas & EMC of IMST in Germany. He has a long-standing experience in phased arrays and related RF topics. His work also involves management and acquisition and coordination/management of long-term EU and ESA projects.

Packaging

11:30-12:00

RF hetero-integration for mm-wave and sub-THz applications: chiplets, interposers, substrates and PCBs

Siddhartha Sinha (Imec)

RF hetero-integration for mm-wave and sub-THz applications: chiplets, interposers, substrates and PCBs

Siddhartha Sinha (Imec)

With the slowing down of Moore’s Law, the focus of electronic systems has shifted from performance improvements by transistor scaling alone to mixing and matching various specialized sub-components for an overall better system. We’ll look at what such a hetero-integrated future will look like for RF and mm-wave systems and how it’s different from its counterpart in the digital world of chiplets. Three specific trends of mm-wave electronic systems will be presented. First, 2.5D and 3D wafer-level and panel-level integration including low-loss RF materials, thermal management and optimized RF design. Second, complementing silicon designs with III-V electronics (GaN and InP) and their upscaling and mass production. Third, a rethink of various mm-wave passive components and antennas using 3D printing and novel manufacturing techniques. We’ll conclude by looking at application examples and the system-level advantages that mm-wave advanced packaging can offer.

Siddhartha Sinha is part of the Advanced RF department of Imec, Leuven, since 2015. He’s responsible for electromagnetic modelling, III-V/CMOS hetero-integration, mm-wave antennas, packaging and system technology co-optimization (STCO) of mm-wave systems. Between 2010-2015, he was a scientist with the Ferdinand-Braun-Institut (FBH), Berlin, Germany working on mm-wave interconnects and equivalent circuit modeling for FBH’s InP transistor technology. Between 2004-2006, he was a scientist at Defense R&D Organization (DRDO), Bangalore, India working on travelling wave tubes. He holds a bachelor’s degree from Visweswaraya Technological University, India and a master’s degree from the Technical University of Munich, Germany.

Packaging

12:00-12:30

Advances in packaging for mm-wave components

Francesca Chiappini (CITC)

Advances in packaging for mm-wave components

Francesca Chiappini (CITC)

This talk addresses the latest technology developments for mm-wave packaging at the Chip Integration Technology Center (CITC), a research institute focusing on technology development for advanced packaging and heterogeneous integration. These technology developments enable a higher degree of integration and improved heat dissipation. In particular, novel packaging methods, based on fan-out technologies and additive manufacturing, offer new possibilities for the in-package integration of RF elements such as antennae and shielding. Furthermore, high-thermal conductivity substrates (eg diamond heat spreaders) and high-performance die attach materials can improve the package heat dissipation, leading to improved performance of high-power RF components such as power amplifiers.

Francesca Chiappini has a background in solid-state physics and obtained her PhD degree from Radboud University in Nijmegen. Currently, she’s program manager at the Chip Integration Technology Center (CITC), where she leads a research team focusing on packaging solutions for RF chips operating in the mm-wave domain. Since 2016, she’s been working at TNO as a researcher in different departments including Holst Centre in Eindhoven, where she worked on interconnect technologies for flexible and printed electronics.

Lunch

12:30-13:30

Antenna technology

13:30-14:00

Trends in array antenna technology

Stefania Monni (TNO Radar Technology)

Trends in array antenna technology

Stefania Monni (TNO Radar Technology)

Active electronically scanning array (AESA) antennas originally developed for military radar have rapidly evolved in the last decennia thanks to huge advances in semiconductor technologies, which enable planar highly integrated architectures with signal digitalization at element level. The inherent flexibility and graceful degradation make AESA an excellent technology base for future advanced radar and communication systems. Two main application areas can be identified: advanced systems designed for defense and space applications, where the primary focus is on superior performance, and commercial systems tailored for areas like automotive applications, prioritizing cost efficiency. Additionally, advances in manufacturing technologies enable the deployment of these antennas on compact platforms, such as miniaturized or conformal antennas for small satellites and UAVs.

While the specific goals and limitations may vary depending on the application, there are common challenges in designing AESA antennas, including achieving wide bandwidth, a broad field of view and frequency selectivity. This talk will discuss novel concepts and trends in antenna technology to deal with these challenges for various AESA-based applications.

Stefania Monni is a senior scientist at TNO’s Radar Technology department, where she leads the Antenna Team, being responsible for the definition and technical coordination of the research activities. She’s one of the main technical advisors in the frame of the Royal Dutch Navy roadmap for the development of the next-generation radar sensor suite and the lead scientist for TNO RF Satcom roadmap. Since 2018, she’s also involved with the Chip Integration Technology Centre in Nijmegen, as senior scientist of the RF Chip Packaging Program. Currently, she’s the president of the European Association of Antennas and Propagation.

Antenna technology

14:00-14:30

Over-the-air measurements of highly integrated mm-wave devices

Anouk Hubrechsen (Antennex)

Over-the-air measurements of highly integrated mm-wave devices

Anouk Hubrechsen (Antennex)

High-frequency antenna systems integrate RF electronics with antennas (eg phased arrays, antenna-on-chip, antenna-in-package). Therefore, the only way to characterize these systems is over the air, requiring new types of testing methods. In this talk, Anouk Hubrechsen details the newest over-the-air measurement techniques for metrics such as noise figure, out-of-band emissions, radiated power spectrum and field distribution in advanced, highly-integrated devices.

Anouk Hubrechsen received the BSc and MSc degrees in electrical engineering from Eindhoven University of Technology in 2017 and 2019, respectively. In 2023, she finished her PhD there on reverberation chamber measurements of mm-wave antennas. She was a guest researcher with the National Institute of Standards and Technology at Boulder, Colorado, US, in 2018 and 2019. There she was involved in reverberation chamber metrology for internet-of-things applications. She is co-founder and CEO of Antennex, which develops instrumentation for measuring integrated antenna systems, based on reverberation chamber technology. The company was named one of Business-Worldwide Magazine’s “20 most innovative companies to watch 2023.”

Test & measurement

13:30-14:00

Thermal measurement solutions with sub-micron spatial resolution

Sidina Wane (eV-Technologies, on behalf of Hitech)

Thermal measurement solutions with sub-micron spatial resolution

Sidina Wane (eV-Technologies, on behalf of Hitech)

The density of semiconductors is increasing and new technology allows to improve efficiency at incredible levels. Besides trapping, thermal effects influence efficiency and behavior of amplifiers. Traditional thermal imaging cameras are limited in resolution and even with a near-infrared camera, the maximum practical resolution is 1.5 micrometer. A Microsanj thermal imaging system based on thermal reflectance can make the difference. With such system, a spatial resolution of ~60nm (100x microscope) can be achieved. Furthermore, by making use of different wavelengths varying from 365-1050 nm, all materials in a device can be selected for calibrated temperature measurements.

Sidina Wane is the CEO and founder of eV-Technologies pioneering Correlation-Technologies for the development of disruptive energyefficient RF, Optics and IoT products. Dr.-Ing.-HDR Wane holds several European and US patents and numerous academic and industrial awards with more than 20 years experience in the semiconductors industry.

Test & measurement

14:00-14:30

Sub-THz load-pull and noise parameter characterization

Sajjad Ahmed (Focus Microwaves)

Sub-THz load-pull and noise parameter characterization

Sajjad Ahmed (Focus Microwaves)

The use of mm-wave and sub-THz frequencies is becoming increasingly important for eg 5G and 6/7G communication. The performance of new circuits that operate at these frequencies heavily relies on the performance of the active devices, but physical limitations lead to degradation of maximum output power and noise behavior. Device characterization techniques like load-pull and noise parameter characterization allow for circuit optimization. Impedance tuners are used to achieve the desired impedance matching in the measurement systems.

This talk presents a state-of-the-art fundamental tuner development, providing coverage from 110-330 GHz. Also discussed are on-wafer calibration and sophisticated probing, including accuracy requirements and procedural approaches for high-frequency, mm-wave and sub-THz measurements.

Sajjad Ahmed received the BSc degree in electronics from the Ghulam Ishaq Khan Institute of Engineering Sciences, Pakistan, in 2005, the MSc degree in electronics from the University of Gavle, Sweden, in 2008, and the PhD degree in electronics from the University of Limoges, France, in 2012. Currently working with Focus Microwaves in Canada, he possesses broad experience in the RF and microwave industry, specializing in developing test and measurement systems for nonlinear device characterizations, load-pull techniques and providing cutting-edge services for semiconductor testing at RF/microwave frequencies.

Break

14:30-15:00

Power

15:00-15:30

Electro-thermal analysis for RF power applications

Stany Denayer (Cadence)

Electro-thermal analysis for RF power applications

Stany Denayer (Cadence)

Electro-thermal simulation analysis is critical in designing and optimizing various electronic systems, such as power electronics, integrated circuits and sensors. In electro-thermal simulation analysis, electrical and thermal models are integrated to simulate the device’s behavior under different operating conditions. The electrical model considers the device’s electrical properties, while the thermal model considers the heat transfer mechanisms, such as conduction, convection and radiation. The simulation results provide valuable insights into the device’s performance, reliability and safety. This talk will highlight how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties and dissipated power simulation results from Microwave Office to provide designers with thermal heat map visualization and operating temperature information critical to design success.

Stany Denayer received his degrees in electrical engineering and biomedical engineering from the universities of Ghent and Brussels in 1984 and 1988, respectively. He started as an RF product developer in various fields such as medical RF heating, CATV, television, satellite communication and radar for several companies, including Barco, Scientific Atlanta, Philips, Newtec and Airbus. More recently, he moved to an application engineer role for Wolfspeed (RF power) and currently Cadence, where he provides technical support in context of the Cadence AWR Design Environment.

Power

15:30-16:00

Unraveling the challenges of designing an RF amplifier for MRI

Bart van Ark (Prodrive Technologies)

Unraveling the challenges of designing an RF amplifier for MRI

Bart van Ark (Prodrive Technologies)

Magnetic resonance imaging (MRI) systems have become indispensable tools in modern medical diagnostics, providing detailed and non-invasive imaging capabilities for a wide range of medical conditions. These systems rely on powerful RF and gradient amplifiers to manipulate nuclei and generate the necessary images. The RF amplifier operates in the Very High Frequency (VHF) band, specifically determined by the Tesla level, and reaches power levels up to tens of kilowatts. For detailed images, these high-power RF amplifiers must be exceptionally stable, linear and low-noise. The high-power operation and standing waves result in thermal and breakdown issues, creating unique challenges during design and qualification. This talk will shed light on the multifaceted challenges of designing such an RF amplifier and the techniques used to improve reliability and performance.

Bart van Ark received the BSc degree in electrical engineering from Fontys University of Applied Sciences in 2011 and the MSc degree in electrical engineering from Eindhoven University of Technology in 2016. Since 2011, he’s been working in the industry at Prodrive Technologies, where he’s responsible for the development of high-power RF amplifiers for the ISM market.

Test & measurement

15:00-15:30

Wideband modulated PA validation in the THz range

Markus Lörner (Rohde & Schwarz)

Wideband modulated PA validation in the THz range

Markus Lörner (Rohde & Schwarz)

Future wireless communication applications like 6G reach out to sub-THz and THz range with increasing bandwidths to enable much higher data throughput and sensing applications. New semiconductor technologies are researched, and already available technologies are optimized for commercialization. Understanding their capabilities for wideband modulation in these frequency bands is a critical aspect. In this talk, Markus Lörner looks at potential technologies and how you can modulation distortion with wide-bandwidth signals at THz frequencies.

Markus Lörner is a market segment manager at Rohde & Schwarz focusing on the RF and microwave component market looking at the test requirements today and tomorrow. He has 20+ years of experience in the T&M industry. Before moving into the market segment role, he worked as a product manager for signal generators and power meters at Rohde & Schwarz, where he was looking at different application areas including the mobile industry, positioning, satellite and EW applications. He received his Dipl.-Ing. degree from the University Erlangen-Nuremberg, Germany.

Test & measurement

15:30-16:00

Merging modulated and S-parameter measurements to simplify and accelerate RF characterization

Marc Vanden Bossche (NI, on behalf of CN Rood)

Merging modulated and S-parameter measurements to simplify and accelerate RF characterization

Marc Vanden Bossche (NI, on behalf of CN Rood)

Passive RF components like filters, connectors and interconnects can be characterized with S-parameters using a vector network analyzer. Also, active components, used as building blocks like LNAs, can be characterized with S-parameters when the small signal behavior is dominant.

In radar and telecom applications, however, the performance of more complex, higher-integrated RF components like RF front-ends and TX/RX modules and systems is strongly dependent on their nonlinear behavior. Therefore, realistic modulation signal generators and analyzers are required to analyze the impact of nonlinearities on the power efficiency, linearity (eg ACPR, EVM) and other performance metrics. At the same time, we want to gain insight into the frequency sensitivity in-band and out-band and understand how well the device matches. S-parameter measurements provide that insight. This talk explains how modulated and S-parameter measurements can be merged into one measurement setup, providing an easy and fast way to get insight into both linear and nonlinear behavior and create specifications for the system under test.

After receiving his PhD in electrical engineering from the Vrije Universiteit Brussel in 1990, Marc Vanden Bossche established a Hewlett-Packard R&D team to work on high-frequency large-signal network analysis. In June 2003, he founded NMDG to commercialize this technology. NMDG was acquired by National Instruments in October 2012. Presently, he’s a distinguished RF network analysis engineer at NI (part of Emerson).

Break

16:00-16:30

EuMA PhD Award

16:30-16:45

The best PhD pitch, selected by the academic members of the program committee, receives € 1,000, sponsored by EuMA.

SiGe technologies for high-resolution radar: circuits, functionality and system-level results

Nils Pohl (Fraunhofer/Ruhr University)

Keynote

16:45-17:30

Navigating the skies: challenges in designing affordable C-UAS and bird detection radar

Rob van der Meer (Robin Radar)

Navigating the skies: challenges in designing affordable C-UAS and bird detection radar

Rob van der Meer (Robin Radar)

Join Rob van der Meer for a compelling keynote presentation as he delves into the challenges faced by engineers and designers in developing affordable counter-unmanned aerial systems (C-UAS) and bird detection radars. In this session, he’ll explore the complex landscape of radar technology, with a special focus on the innovative RF solutions pioneered by companies such as Robin Radar Systems. Balancing cost constraints with performance requirements, the discussion will span technological hurdles, regulatory considerations and the dynamic nature of UAS capabilities. Discover how the industry is addressing the evolving threat landscape while ensuring airspace safety. Gain insights into the struggles and advancements in radar design and the role of companies like Robin Radar Systems in shaping the future of airspace security.

Rob van der Meer earned his degree in electrical engineering at Delft University of Technology in 2003, after which he embarked on a career journey at TNO Defense & Security, where he gained his knowledge in the evolving field of science of radar technologies. In 2010, he transitioned to Robin Radar Systems, leading the innovation team. Over the last 12 years, the company has been at the forefront of driving technological advancements in detecting and classifying small airborne targets, particularly in the realms of counter-unmanned aerial systems (C-UAS) and bird detection radar.

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Sessions on product-specific applications with a focus on innovative solutions in combination with advanced wireless technology

In-depth sessions highlighting trends such as RF energy and RF power and focusing on engineers, designers and technical managers in the advanced RF field

Target audience

Engineers
Team leaders
Technical managers
Product developers
Innovation managers

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Van der Valk Hotel Nijmegen-Lent
Hertog Eduardplein 4
6663 AN Nijmegen
Next to train station Nijmegen-Lent

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